The MEMS technology uses integrated circuit processing techniques to create precise and moveable structures on silicon substrates.
MEMS are the union of microelectronics and micromachining technologies.
It is MEMS technology and the design expertise in electronics driver designs that makes Sercalo's products stand out in the market.
Sercalo's patented MEMS technology is based on micromirrors fabricated in single crystal silicon.
MEMS are used in telecommunication networks at different levels such as in tunable lasers, tunable filters, optical switches, dynamic gain equalizers, attenuators. Sercalo's products are highly reliable due to mature MEMS technology. There is no sticking, no friction, no wear out, nor fatigue. This is why a MEMS switch can operate billions of cycles maintaining the same output results (for example, constant insertion loss).
Sercalo qualifies its fiber optic components according to the Telcordia 1221 standard (mechanical shocks, vibration, high number of thermal cycles, damp heat etc.)
Sercalo has an in house design expertise and manufacturing capabilities in:
• MEMS design and manufacture based on deep reactive ion etching
• Electronics design
• Precision MEMS microassembly
• Fiber Optic MEMS packaging
• Test and Measurement of critical optical and mechanical parameters
MEMS are used in telecommunication networks at different levels such as in tunable lasers, tunable filters, optical switches, dynamic gain equalizers, attenuators. Sercalo’s products are highly reliable due to mature
MEMS technology. There is no sticking, no friction, no wear out, nor fatigue. This is why a MEMS switch can operate billions of cycles maintaining the same output results.
Sercalo qualifies its fiber optic components according to the Telcordia 1221 standard (mechanical shocks, vibration, high number of thermal cycles, damp heat etc.)
Wet Processing | |
• Photolithography | |
• Wet Etching | |
• HF Vapor release |
Dry Processing | |
• DRIE Etching | |
• O2 Plasma cleaning | |
• PVD | |
• Dry & Wet oxidation |
Assembly Line | |
• Wafer Probing | |
• Automated Pick & place | |
• Wire Bonding | |
• Pigtail assembly | |
• Package sealing | |
• Laser Welding | |
• Fiber optic Test and Measurement |
Qualification | |
• Mechanical shock | |
• Vibration | |
• Thermal cycles | |
• Damp heat |
“Sercalo is a highly competitive and trustable partner.”
Radek Sedlacik, FINISAR